{"id":4447,"date":"2023-10-10T16:02:44","date_gmt":"2023-10-10T16:02:44","guid":{"rendered":"https:\/\/smans.com\/product\/asscon-vp1000\/"},"modified":"2023-10-10T16:16:38","modified_gmt":"2023-10-10T16:16:38","slug":"asscon-vp1000","status":"publish","type":"product","link":"https:\/\/smans.dev.falkor.alcor.cloud\/en\/product\/asscon-vp1000\/","title":{"rendered":"Asscon &#8211; VP1000"},"content":{"rendered":"<p>ASSCON\u2019s Vapor-Phase Reflow Soldering machines set<br \/>\nthe benchmark in soldering technology.<br \/>\nThe modern design of the machines and the physical laws<br \/>\nof the process permit to defect-free soldering of the most<br \/>\ncomplicated SMT assemblies even with leadfree solder<br \/>\npastes. Components such as QFPs, BGAs, Flip-Chips as<br \/>\nwell hybrid assemblies may be processed with high quality<br \/>\nresults.<br \/>\nThe machine series VP 1000 is offered in two model variants<br \/>\nfor assemblies with maximum size of 610 x 460 mm<br \/>\nor 610 x 610 mm.<br \/>\nThe machines are particularly suited for users who process<br \/>\nproduct with frequently changing assemblies in small<br \/>\nand medium sized quantities. Universal workpiece carriers<br \/>\nmake the systems very flexible.<br \/>\nThe physical laws during vapor phase soldering guarantees<br \/>\ncompletely stable process conditions. The whole soldering<br \/>\nprocess takes place in an oxygen-free atmosphere.<br \/>\nOverheating of assemblies, damage to components and<br \/>\nde-lamination of printed circuit boards cannot occur, as the<br \/>\nmaximum solder product temperature cannot exceed the<br \/>\nboiling point of the medium.<br \/>\nThe heat transfer takes place during condensation of the<br \/>\nvapor on the assembly. By adjusting the energy supply during<br \/>\nthe pre-heating and soldering process the temperature<br \/>\ngradient is effectively programmable.<br \/>\nThis ensures a homogeneous energy distribution for the<br \/>\nwhole assembly. Therefore three-dimensional assemblies<br \/>\nmay be processed without any problem.<\/p>\n<p>Machine design<br \/>\nThe machine\u2019s construction is self-supporting. The machine<br \/>\nmodules include infeed and exit stations, soldering<br \/>\nzone, cooling and control.<br \/>\nThe key unit of the compact multi chambers machine is<br \/>\nthe process chamber made of stainless steel. Large area<br \/>\nheaters mounted on the outside are insulated external heat<br \/>\nradiation. Temperature sensors for heaters, fluid, vapor and<br \/>\ncooling zone temperatures ensure consistant process dependability.<br \/>\nThe efficient cooling zone of the machine is equipped with<br \/>\na special blower system, which circulates the medium and<br \/>\nflux residues, emanating from the assembly, through a<br \/>\ncooling cassette and on to an internal filtration cycle.<br \/>\nAn automatic filtration system for microfiltration of the heat<br \/>\ntransfer medium is integrated in the machine.<br \/>\nThe machine also features an integrated exhaust system<br \/>\nto remove vapors and odors that de-gas from the printed<br \/>\ncircuit boards outside of the process chamber. The controller<br \/>\nis pre-programmed for the connection of an external<br \/>\nblower.<br \/>\nThe process cooling system is integrated in the base of<br \/>\nthe machine.<br \/>\nThe machine\u2019s controller unit is located in an integrated<br \/>\ncontrol case and comprises switch, control, regulator and<br \/>\nsafety\/fuse elements for all function units. The process is<br \/>\ncontrolled and monitored with a failure message system<br \/>\nvia microcontroller with colour-touch-screen and intelligent<br \/>\noperational panel.<\/p>\n<p>Soldering process<br \/>\nUsing vapor as the heat transfer medium the solder product<br \/>\n\u2013 independent of its size or weight \u2013 is homogeneously<br \/>\nheated to pre-heat and soldering temperature. Geometric<br \/>\nparameters, such as component form, packing density, are<br \/>\nunimportant for the heating process. Due to the high density<br \/>\nof the vapor the oxygen is displaced from the heating<br \/>\nand soldering area. Consequently, no protective gases are<br \/>\nnecessary.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>ASSCON\u2019s Vapor-Phase Reflow Soldering machines set the benchmark in soldering technology. The modern design of the machines and the physical laws of the process permit to defect-free soldering of the most complicated SMT assemblies even with leadfree solder pastes. Components such as QFPs, BGAs, Flip-Chips as well hybrid assemblies may be processed with high quality&#8230;<\/p>\n","protected":false},"featured_media":0,"comment_status":"open","ping_status":"closed","template":"","meta":[],"pwb-brand":[],"product_cat":[1588,1554],"product_tag":[],"class_list":["post-4447","product","type-product","status-publish","hentry","product_cat-smt-assembly-equipment-2","product_cat-soldering"],"acf":[],"brands":[],"_links":{"self":[{"href":"https:\/\/smans.dev.falkor.alcor.cloud\/en\/wp-json\/wp\/v2\/product\/4447","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/smans.dev.falkor.alcor.cloud\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/smans.dev.falkor.alcor.cloud\/en\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/smans.dev.falkor.alcor.cloud\/en\/wp-json\/wp\/v2\/comments?post=4447"}],"wp:attachment":[{"href":"https:\/\/smans.dev.falkor.alcor.cloud\/en\/wp-json\/wp\/v2\/media?parent=4447"}],"wp:term":[{"taxonomy":"pwb-brand","embeddable":true,"href":"https:\/\/smans.dev.falkor.alcor.cloud\/en\/wp-json\/wp\/v2\/pwb-brand?post=4447"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/smans.dev.falkor.alcor.cloud\/en\/wp-json\/wp\/v2\/product_cat?post=4447"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/smans.dev.falkor.alcor.cloud\/en\/wp-json\/wp\/v2\/product_tag?post=4447"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}